Direct Wafer Bonding
Author:
Publisher
Wiley-VCH Verlag GmbH & Co. KGaA
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/9783527644223.ch5/fullpdf
Reference87 articles.
1. Direct bonding: from an optical technology to a broad research topic;Biermann;Philips J. Res.,1995
2. A study of glass surfaces in optical contact;Rayleigh;Proc. R. Soc. Lond. A,1936
3. Field assisted glass-metal sealing;Wallis;J. Appl. Phys.,1969
4. Wafer bonding for silicon-on-insulator technologies;Lasky;Appl. Phys. Lett.,1986
5. Silicon-to-silicon direct bonding method;Shimbo;J. Appl. Phys.,1986
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