Direct Wafer Bonding

Author:

Reiche Manfred,Gösele Ulrich

Publisher

Wiley-VCH Verlag GmbH & Co. KGaA

Reference87 articles.

1. Direct bonding: from an optical technology to a broad research topic;Biermann;Philips J. Res.,1995

2. A study of glass surfaces in optical contact;Rayleigh;Proc. R. Soc. Lond. A,1936

3. Field assisted glass-metal sealing;Wallis;J. Appl. Phys.,1969

4. Wafer bonding for silicon-on-insulator technologies;Lasky;Appl. Phys. Lett.,1986

5. Silicon-to-silicon direct bonding method;Shimbo;J. Appl. Phys.,1986

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1. Transport of Charge Carriers along Dislocations in Si and Ge;physica status solidi (a);2019-07-17

2. Conductivity of high-temperature annealed silicon direct wafer bonds;Microsystem Technologies;2015-01-31

3. Single-electron transitions in one-dimensional native nanostructures;Journal of Physics: Conference Series;2014-12-08

4. On the electronic properties of a single dislocation;Journal of Applied Physics;2014-05-21

5. Trap-assisted tunneling on extended defects in tunnel field-effect transistors;Japanese Journal of Applied Physics;2014-01-01

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