P-11: Channel-Etched CAAC-OS FETs using Multi-layer IGZO
Author:
Affiliation:
1. Advanced Film Device Inc, Tochigi, Japan
2. Semiconductor Energy Laboratory Co., Ltd, Atsugi, Japan
Publisher
Wiley
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/sdtp.10037/fullpdf
Reference9 articles.
1. 8.3:Invited Paper: Advantages of IGZO Oxide Semiconductor
2. 33.1: Channel-Etched C-Axis Aligned Crystalline Oxide Semiconductor FET Using Cu Wiring
3. Development of Back-channel-etched TFT Using C-Axis Aligned Crystalline In-Ga-Zn-Oxide;Koezuka;SID Symposium Digest,2013
4. 3.3:Invited Paper: Future Possibility of C-Axis Aligned Crystalline Oxide Semiconductors Comparison with Low-Temperature Polysilicon
5. Conduction mechanisms in thin-film accumulation-mode SOI p-channel MOSFETs
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1. P‐8: Analysis of Degradation Mechanism of Oxide Semiconductor FETs with High Tolerance to Intense NBTIS;SID Symposium Digest of Technical Papers;2022-06
2. 9‐4: Fabrication of Oxide‐Semiconductor FETs with Submicron Channel Length;SID Symposium Digest of Technical Papers;2021-05
3. 76-2: Field-Effect Transistor with CAAC/CAC-OS Double-Layer Structure for Diversion of Gen 8-10.5 Amorphous Silicon Production Lines;SID Symposium Digest of Technical Papers;2017-05
4. Applications of CAAC-IGZO FETs to Displays;Physics and Technology of Crystalline Oxide Semiconductor CAAC-IGZO;2016-11-18
5. Introduction;Physics and Technology of Crystalline Oxide Semiconductor CAAC-IGZO;2016-11-18
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