Author:
Tian Yu,Tong Ling,Li Hailiang
Subject
Electrical and Electronic Engineering,Computer Science Applications,Modelling and Simulation
Reference14 articles.
1. Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects;Li;IEEE Transactions on Electromagnetic Compatability,2010
2. The equivalent circuit of a via;Wang;Transactions of the Society for Computer Simulation International,1987
3. Characterization of via connections in silicon circuit boards;Quine;IEEE Transactions on Microwave Theory and Techniques,1988
4. Quasi-static analysis of a microstrip via through a hole in a ground plane;Wang;IEEE Transactions on Microwave Theory and Techniques,1988
5. The excess capacitance of a microstrip via in a dielectric substrate;Wang;IEEE Transactions on Computer-Aided Design,1990
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献