The excess capacitance of a microstrip via in a dielectric substrate-Reference-Cited by-同舟云学术

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The excess capacitance of a microstrip via in a dielectric substrate

Published:1990 Issue:1 Volume:9 Page:48-56
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Wang T.,Mautz J.R.,Harrington R.F.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

http://xplorestaging.ieee.org/ielx1/43/1732/00045856.pdf?arnumber=45856

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Novel hybrid analysis method for via structure in microwave multilayer circuits;International Journal of Numerical Modelling: Electronic Networks, Devices and Fields;2011-03-21

3. RF/microwave modeling and comparison of buried, blind and through-hole vias;Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971);2004

4. Equivalent network synthesis for via holes discontinuities;IEEE Transactions on Advanced Packaging;2002-11

5. Method of lines for the calculation of excess capacitance for a cylindrical via hole in multilayer packaging;IEE Proceedings - Microwaves, Antennas and Propagation;1999

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