Circuit model and signal integrity analysis for multilayer printed circuit board interconnection-Reference-Cited by-同舟云学术

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Circuit model and signal integrity analysis for multilayer printed circuit board interconnection

Published:2013-10-29 Issue:4 Volume:24 Page:478-489
ISSN:1096-4290
Container-title:International Journal of RF and Microwave Computer-Aided Engineering
language:en
Short-container-title:Int J RF and Microwave Comp Aid Eng

Author:

Kong Fan¹,Sheng Weixing¹,Ma Xiaofeng¹,Han Yubing¹

Affiliation:

1. School of Electronic and Optical Engineering, Nanjing University of Science and Technology; Nanjing 210094 China

Funder

the National Natural Science Foundation of China

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications

Reference21 articles.

1. Finite-element method applied to EMC problems (PCB environment);Laroussi;IEEE Trans Electromagn Compatibility,1933

2. Meander delay line challenge problem: A comparison using FDTD, FEM and MoM;Bhobe;IEEE Int Symp Electromagn Compatibility,2001

3. Signal integrity analysis for high-speed circuit PCB interconnection with an efficient full wave method;Kong;Int J RF Microwave Comput-Aided Eng,2013

4. I.J. Bahl Lumped elements for RF and microwave circuits Artech House Boston 279 286

5. H. Johnson M. Graham High-speed digital design Publishing House of Electronics Industry Beijing 197 206

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