Characterization of via connections in silicon circuit boards-Reference-Cited by-同舟云学术

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Characterization of via connections in silicon circuit boards

Published:1988 Issue:1 Volume:36 Page:21-27
ISSN:0018-9480
Container-title:IEEE Transactions on Microwave Theory and Techniques
language:
Short-container-title:IEEE Trans. Microwave Theory Techn.

Author:

Quine J.P.,Webster H.F.,Glascock H.H.,Carlson R.O.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Radiation

Link

http://xplorestaging.ieee.org/ielx1/22/196/00003477.pdf?arnumber=3477

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Efficient Total Crosstalk Analysis of Large Via Arrays in Silicon Interposers;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-12

2. Efficient Computation of Localized Fields for Through Silicon Via Modeling Up to 500 GHz;IEEE Transactions on Components, Packaging and Manufacturing Technology;2015-12

3. A New Model for Through-Silicon Vias on 3-D IC Using Conformal Mapping Method;IEEE Microwave and Wireless Components Letters;2012-06

4. Modeling of Through-Silicon Vias (TSV) in 3D Integration;Electrical Modeling and Design for 3D System Integration;2012-04-06

5. Minimization of Via-Induced Signal Reflection in On-Chip High Speed Interconnect Lines;Circuits, Systems, and Signal Processing;2011-07-30

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