Efficient Total Crosstalk Analysis of Large Via Arrays in Silicon Interposers-Reference-Cited by-同舟云学术

Efficient Total Crosstalk Analysis of Large Via Arrays in Silicon Interposers

Published:2016-12 Issue:12 Volume:6 Page:1889-1898
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Dahl David¹^ORCID,Reuschel Torsten¹,Preibisch Jan Birger¹,Duan Xiaomin²,Ndip Ivan³,Lang Klaus-Dieter³,Schuster Christian¹

Affiliation:

1. Institut für Theoretische Elektrotechnik, Technische Universität Hamburg, Hamburg, Germany

2. IBM Deutschland Research and Development GmbH, Böblingen, Germany

3. Fraunhofer Institute for Reliability and Microintegration IZM, Berlin, Germany

Funder

Deutsche Forschungsgemeinschaft

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Routing Length Impact on Differential Via Crosstalk Cancellation;2023 IEEE 27th Workshop on Signal and Power Integrity (SPI);2023-05-07

3. Fast Calculation and Optimization of Dense Signal/Ground Vias in System-in-Package;2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC);2022-09-01

5. Bayesian Optimization for Signal Transmission Including Crosstalk in a Via Array;2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE;2020-09-23