Fast Calculation and Optimization of Dense Signal/Ground Vias in System-in-Package
Author:
Affiliation:
1. Zhejiang University,College of Information Science and Electronic Engineering,Hangzhou,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9888259/9888262/09888537.pdf?arnumber=9888537
Reference10 articles.
1. Convergence Acceleration and Accuracy Improvement in Power Bus Impedance Calculation With a Fast Algorithm Using Cavity Modes
2. Electromagnetic Shielding Analysis of Different Grounded Bump Distribution in SiP
3. Fast Prediction for Electromagnetic Shielding Effectiveness of Ground-Via Distribution of SiP by Convolutional Neural Network
4. Fast Calculation of PCB Electromagnetic Radiation Using 1D Boundary Integration
5. Planar Circuits for Microwaves and Lightwaves
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1. A Novel Deep Reinforcement Learning Methodology for EMI Mitigation in Multiscenario Pinmap Design;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07
2. Pin Assignment Optimization of BGA Packages for EMI Mitigation Using Deep Reinforcement Learning;2023 International Applied Computational Electromagnetics Society Symposium (ACES-China);2023-08-15
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