Cubic Silicon Carbide: Growth, Properties, and Electrochemical Applications
Author:
Affiliation:
1. Institute of Materials Engineering; University of Siegen; Paul-Bonatz-Str. 9-11 57076 Siegen Germany
Publisher
John Wiley & Sons, Ltd
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/9781119313649.ch1/fullpdf
Reference124 articles.
1. Unterfuchungiiber die Flufsfpathaure und deven merkwiirdigften Verbindungen;Berzelius;Ann. Phys.,1824
2. Étude du siliciure de carbone de la météorite de Cañon Diablo;Moissan;C. R. Acad. Sci.,1905
3. Chloride-based CVD growth of silicon carbide for electronic applications;Pedersen;Chem. Rev.,2012
4. A review of silicon carbide development in MEMS applications;Jiang;Int. J. Comput. Mater. Sci. Surf. Eng.,2009
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