Millimetric LNAs for astronomy: characterization at cryogenic temperature-Reference-Cited by-同舟云学术

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Millimetric LNAs for astronomy: characterization at cryogenic temperature

Published:2015-04-21 Issue:6 Volume:28 Page:745-754
ISSN:0894-3370
Container-title:International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
language:en
Short-container-title:Int. J. Numer. Model.

Author:

Zannoni M.¹

Affiliation:

1. Physics Department “G. Occhialini”; University of Milano Bicocca; Piazza della Scienza 3 - 20126 Milano Italy

Funder

Italian Space Agency

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Science Applications,Modelling and Simulation

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/jnm.2069/fullpdf

Reference21 articles.

1. High electron mobility transistor gain stability and its design implications for wide band millimeter wave receivers;Wollack;Rev Sci Instrum,1995

2. Bryerton EW Morgan M Pospieszalski MW Ultra low noise cryogenic amplifiers for radio astronomy Radio and Wireless Symposium (RWS), 2013 IEEE Austin, Tx 2013 358 360 10.1109/RWS.2013.6486740

3. Leuther A Tessmann A Kalfass I Losch R Seelmann-Egge-bert M Wadefalk N Schafer F Gallego-Puyol JD Schlechtweg M Mikulla M Ambacher O Metamorphic HEMT technology for low-noise applications Proc InP Rel Mater Conf Newport Beach, CA 2009 188 191

4. MMICLNAs for radioastronomy applications using advanced industrial 70 nm meta-morphic technology;Ciccognani;IEEE J Solid-State Circuits,2010

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1. Innovative techniques for achieving flat response in a dual-resonance ultra-wideband low-noise amplifier;Physica Scripta;2024-07-08

2. Measurement-Based Extraction and Analysis of a Temperature-Dependent Equivalent-Circuit Model for a SAW Resonator: From Room Down to Cryogenic Temperatures;IEEE Sensors Journal;2021-05-15

3. Equivalent‐circuit–based modeling of the scattering and noise parameters for multi‐finger GaAs pHEMTs;International Journal of Numerical Modelling: Electronic Networks, Devices and Fields;2019-03

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