P‐66: Low Coefficient of Thermal Expansion (CTE) Display Glass Minimizes Chip on Glass (COG) Light Leakage (LL) from Chip Warp-Reference-Cited by-同舟云学术

P‐66: Low Coefficient of Thermal Expansion (CTE) Display Glass Minimizes Chip on Glass (COG) Light Leakage (LL) from Chip Warp

Published:2019-05-29 Issue:1 Volume:50 Page:1481-1484
ISSN:0097-966X
Container-title:SID Symposium Digest of Technical Papers
language:en
Short-container-title:SID Symposium Digest of Technical Papers

Author:

Greene Raymond G.¹,Ishikawa Tomohiro¹,Akarapu Ravindra K.¹

Affiliation:

1. Corning Glass Technologies, Corning Incorporated Corning NY U.S.A

Publisher

Wiley

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/sdtp.13221

Reference12 articles.

1. R. G.Greene R. K.Akarapu T.IshikawaandK. H.Vepakomma "Panel stress state determines light leakage in curved LCD " inSID 2017 Digest 2017.

2. A Study of Process-Induced Deformations of Anisotropic Conductive Film (ACF) Assembly

3. Effects of localized warpage and stress on chip-on-glass packaging: Induced light-leakage phenomenon in midsized TFT-LCD;Leu J.;Journal of the SID,2012

4. Q.Jia J.You H.Li Z.Dong X.Wang Y.Zhan B.Zhang X.Sun X.XuandJ.Yao "Investigation of IC position for reducing chip-on-glass mura by quantified model " inSID 2018 Digest 2018.

5. Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly

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