Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly-Reference-Cited by-同舟云学术

Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly

Published:2005-11 Issue:11 Volume:34 Page:1455-1461
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Hwang J. W.,Yim M. J.,Paik K. W.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-005-0205-3.pdf

Reference9 articles.

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3. M. Dernevik, R. Sihlborn, K. Axelsson, Z. Lai, J. Liu, and P. Starski, Proc. 48th Electron. Comp. Technol. Conf., p. 1026 (1998).

4. R.J. Varley, J.H. Hodgkin, and G.P. Simon, J. Appl. Polymer Sci. 77, 237 (2000).

5. K. Sridhar and Thein Kyu, J. Appl. Polymer Sci. 77, 1257 (2000).

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