P-61: Investigation of IC Position for Reducing Chip-on-Glass Mura by Quantified Model-Reference-Cited by-同舟云学术

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P-61: Investigation of IC Position for Reducing Chip-on-Glass Mura by Quantified Model

Published:2018-05 Issue:1 Volume:49 Page:1429-1432
ISSN:0097-966X
Container-title:SID Symposium Digest of Technical Papers
language:en
Short-container-title:

Author:

Jia Qian¹²,You Jaegeon¹²,Li Hongmin¹²,Dong Zhifu¹²,Wang Xinxing¹²,Zhan Yucheng¹²,Zhang Bin¹²,Sun Xuefei¹²,Xu Xiaona¹²,Yao Jikai¹²

Affiliation:

1. BOE Technology Group Co., LTD; No.9 Dize Rd, BDA Beijing China

2. Hefei BOE Optoelectronics Technology Co., LTD; No.2177 Tonglingbei RD Hefei, Anhui China

Publisher

Wiley

Reference7 articles.

1. Experimental and Numerical Studies of Warpages of ACF-Bonded COG Packages Induced From Manufacturing and Thermal Cycling;Ming-Yi;IEEE,2007

2. Study of Several Key Reliability Problems of COG/ACF Interconnect in LCD Module;Bin;IEEE,2006

3. Thermal and Mechanical Loading Effects on the Reliability of COG-ACF with Thin Glass by FEA;Xie;IEEE,2006

4. Thermal and Mechanical Loading Effects on the Reliability of COG-ACF with Thin Glass by FEA;Xie;IEEE,2006

5. A Study of Process-Induced Deformations of Anisotropic Conductive Film (ACF) Assembly;Cheng;IEEE,2006

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. P‐66: Low Coefficient of Thermal Expansion (CTE) Display Glass Minimizes Chip on Glass (COG) Light Leakage (LL) from Chip Warp;SID Symposium Digest of Technical Papers;2019-05-29

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