Ultra‐low loss polyphenylene oxide‐based composites with negative thermal expansion fillers-Reference-Cited by-同舟云学术

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Ultra‐low loss polyphenylene oxide‐based composites with negative thermal expansion fillers

Published:2022-12-14 Issue:3 Volume:44 Page:1849-1858
ISSN:0272-8397
Container-title:Polymer Composites
language:en
Short-container-title:Polymer Composites

Author:

Zhu Xiaotao¹,Fang Zeming¹,Yi Ying¹,Wang Zeru¹,Meng Yeqiao²,Liu Qianfa³,Wang Ke¹^ORCID

Affiliation:

1. School of System Design and Intelligent Manufacturing Southern University of Science and Technology Shenzhen China

2. Design and Polymerization Reaction of Fluorinate Polymer Laboratory State Key Laboratory of Fluorinated Functional Membrane Materials Zibo China

3. National Engineering Research Center of Electronic Circuits Base Materials Shengyi Technology Co., Ltd Dongguan China

Funder

Department of Science and Technology of Shandong Province

Guangdong Science and Technology Department

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Ceramics and Composites

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pc.27209

Reference45 articles.

1. Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging

2. Emerging challenges in the thermal management of cellulose nanofibril-based supercapacitors, lithium-ion batteries and solar cells: A review

3. Recent advances in polymer-based electronic packaging materials

4. Preparation and properties of polyimide nanocomposites with negative thermal expansion nanoparticle filler

5. Springer Handbook of Electronic and Photonic Materials

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1. Polyphenylene oxide/SiO2 composites: Towards ultra-low dielectric loss and high thermal conductivity of microwave substrates;Applied Surface Science;2024-11

2. Predictive modeling of dielectric properties in crosslinked polyphenylene oxide systems: Molecular dynamics simulations and experimental validation;Polymer Engineering & Science;2024-07-25

3. Application of Multi-Vinyl Silicon-Containing Cross-Linkers in Free-Radical Cross-Linked Thermosets with Ultra-Low Dielectric Loss;Industrial & Engineering Chemistry Research;2024-06-20

4. Recent Progress in Modification of Polyphenylene Oxide for Application in High-Frequency Communication;Materials;2024-02-27

5. Polyphenylene oxide/boron nitride–alumina hybrid composites with high thermal conductivity, low thermal expansion and ultralow dielectric loss;Polymer Composites;2024-01-14

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