Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging-Reference-Cited by-同舟云学术

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Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging

Published:2022-01 Issue: Volume:22 Page:100594
ISSN:2542-5293
Container-title:Materials Today Physics
language:en
Short-container-title:Materials Today Physics

Author:

Li R.,Yang X.,Li J.,Shen Y.,Zhang L.,Lu R.,Wang C.,Zheng X.,Chen H.,Zhang T.

Publisher

Elsevier BV

Subject

Physics and Astronomy (miscellaneous),Energy (miscellaneous),General Materials Science

Reference136 articles.

1. Emerging challenges in the thermal management of cellulose nanofibril-based supercapacitors, lithium-ion batteries and solar cells: a review;Zhang;Carbohydr. Polym.,2020

2. Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: a review;He;Energy,2021

3. An experimental approach to investigate thermal performance of paraffin wax and 1-hexadecanol based heat sinks for cooling of electronic system;Leong;Int. Commun. Heat Mass Tran.,2019

4. Thermally conductive ultra-low-k dielectric layers based on two-dimensional covalent organic frameworks;Evans;Nat. Mater.,2021

5. High performance of low-temperature-cofired ceramic with Al2O3/BN biphasic ceramics based on B2O3–Bi2O3–SiO2–ZnO glass;Feng;Adv. Eng. Mater.,2020

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