Application of Multi-Vinyl Silicon-Containing Cross-Linkers in Free-Radical Cross-Linked Thermosets with Ultra-Low Dielectric Loss-Reference-Cited by-同舟云学术

Application of Multi-Vinyl Silicon-Containing Cross-Linkers in Free-Radical Cross-Linked Thermosets with Ultra-Low Dielectric Loss

Published:2024-06-20 Issue:26 Volume:63 Page:11472-11484
ISSN:0888-5885
Container-title:Industrial & Engineering Chemistry Research
language:en
Short-container-title:Ind. Eng. Chem. Res.

Author:

Fang Zeming¹²,Zhu Xiaotao¹²,Yi Ying¹²,Liu Qianfa³,Wang Ke¹²^ORCID

Affiliation:

1. Shenzhen Key Laboratory of Intelligent Manufacturing for Continuous Carbon Fiber Reinforced Composites, Southern University of Science and Technology, Shenzhen 518055, China

2. School of System Design and Intelligent Manufacturing, Southern University of Science and Technology, Shenzhen 518055, China

3. National Engineering Research Center of Electronic Circuits Base Materials, Shengyi Technology Co., Ltd, Dongguan 523000, China

Funder

Guangdong Provincial Department of Science and Technology

National Natural Science Foundation of China

Shenzhen Key Laboratory of Intelligent Manufacturing for Continuous Carbon Fibre Reinforced Composites

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.iecr.4c01202

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