Depth strain profile with sub-nm resolution in a thin silicon film using medium energy ion scattering

Author:

Jalabert D.,Pelloux-Gervais D.,Béché A.,Hartmann J. M.,Gergaud P.,Rouvière J. L.,Canut B.

Publisher

Wiley

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Recent advances in MEIS;Surface and Interface Analysis;2019-11-28

2. Bibliography;Swift Ion Beam Analysis in Nanosciences;2017-08-25

3. On the use of MEIS cartography for the determination of Si 1–x Ge x thin-film strain;Thin Solid Films;2016-07

4. Identification of donor deactivation centers in heavily As-doped Si using time-of-flight medium-energy ion scattering spectroscopy;Journal of Applied Physics;2015-10-07

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