Failure Mechanisms in Flip‐Chip Bonding on Stretchable Printed Electronics-Reference-Cited by-同舟云学术

Failure Mechanisms in Flip‐Chip Bonding on Stretchable Printed Electronics

Published:2021-09-28 Issue:12 Volume:23 Page:2100264
ISSN:1438-1656
Container-title:Advanced Engineering Materials
language:en
Short-container-title:Adv Eng Mater

Author:

Behfar Mohammad H.¹^ORCID,Khorramdel Behnam²^ORCID,Korhonen Arttu¹^ORCID,Jansson Elina¹,Leinonen Aleksis²,Tuomikoski Markus¹^ORCID,Mäntysalo Matti²^ORCID

Affiliation:

1. VTT Research Center of Finland Oulu 90570 Finland

2. Faculty of Information Technology and Communication Sciences Tampere University 33720 Tampere Finland

Funder

Academy of Finland

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adem.202100264

Reference41 articles.

1. D.Gräf J.Franke N.Ischdonat M.Hedges J.Hörber in2017 21st European Microelectronics and Packaging Conf. (EMPC) Exhibition Warsaw Poland2017 pp.1–6.

2. N.Ischdonat C.Dreyer D.Gräf J.Franke J.Hörber M.Hedges in2018 13th Int. Congress Molded Interconnect Devices (MID) Würzburg Germany2018 pp.1–5.

3. OE-A Roadmap for Organic and Printed Electronics VDMA Verlag 2017edition.

4. A New Frontier of Printed Electronics: Flexible Hybrid Electronics

5. A Circuits and Systems Perspective of Organic/Printed Electronics: Review, Challenges, and Contemporary and Emerging Design Approaches

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