One-step generating protect film resisting ozone and strong acid on conductive silicone adhesive with atmospheric pressure plasma-assisted
Author:
Funder
New Energy and Industrial Technology Development Organization
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference41 articles.
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4. Failure mechanisms in flip-chip bonding on stretchable printed electronics;Behfar;Adv. Eng. Mater.,2021
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