Technology Roadmap for Flexible Sensors

Author:

Luo Yifei12ORCID,Abidian Mohammad Reza3,Ahn Jong-Hyun4ORCID,Akinwande Deji56ORCID,Andrews Anne M.7ORCID,Antonietti Markus8ORCID,Bao Zhenan9ORCID,Berggren Magnus1011ORCID,Berkey Christopher A.12,Bettinger Christopher John13ORCID,Chen Jun14ORCID,Chen Peng15,Cheng Wenlong1617ORCID,Cheng Xu18,Choi Seon-Jin19ORCID,Chortos Alex20ORCID,Dagdeviren Canan21ORCID,Dauskardt Reinhold H.12,Di Chong-an22ORCID,Dickey Michael D.23ORCID,Duan Xiangfeng24ORCID,Facchetti Antonio25ORCID,Fan Zhiyong26ORCID,Fang Yin15ORCID,Feng Jianyou27,Feng Xue28ORCID,Gao Huajian2930ORCID,Gao Wei31ORCID,Gong Xiwen32ORCID,Guo Chuan Fei33,Guo Xiaojun34,Hartel Martin C.14,He Zihan22,Ho John S.353637ORCID,Hu Youfan38ORCID,Huang Qiyao39,Huang Yu40ORCID,Huo Fengwei41ORCID,Hussain Muhammad M.42,Javey Ali4344,Jeong Unyong45ORCID,Jiang Chen46,Jiang Xingyu47ORCID,Kang Jiheong48,Karnaushenko Daniil49,Khademhosseini Ali50,Kim Dae-Hyeong51ORCID,Kim Il-Doo52ORCID,Kireev Dmitry56ORCID,Kong Lingxuan15,Lee Chengkuo36535455ORCID,Lee Nae-Eung56ORCID,Lee Pooi See5758ORCID,Lee Tae-Woo59606162ORCID,Li Fengyu63,Li Jinxing64,Liang Cuiyuan65,Lim Chwee Teck666768ORCID,Lin Yuanjing69,Lipomi Darren J.70ORCID,Liu Jia71ORCID,Liu Kai72ORCID,Liu Nan73ORCID,Liu Ren71,Liu Yuxin174,Liu Yuxuan75ORCID,Liu Zhiyuan76ORCID,Liu Zhuangjian30,Loh Xian Jun1ORCID,Lu Nanshu77ORCID,Lv Zhisheng1,Magdassi Shlomo78ORCID,Malliaras George G.79ORCID,Matsuhisa Naoji80ORCID,Nathan Arokia81,Niu Simiao82,Pan Jieming36ORCID,Pang Changhyun83ORCID,Pei Qibing84ORCID,Peng Huisheng27ORCID,Qi Dianpeng65ORCID,Ren Huaying85ORCID,Rogers John A.8687ORCID,Rowe Aaron8889,Schmidt Oliver G.499091,Sekitani Tsuyoshi92ORCID,Seo Dae-Gyo59,Shen Guozhen93ORCID,Sheng Xing94ORCID,Shi Qiongfeng365354,Someya Takao95ORCID,Song Yanlin96ORCID,Stavrinidou Eleni97ORCID,Su Meng96,Sun Xuemei27ORCID,Takei Kuniharu98ORCID,Tao Xiao-Ming99ORCID,Tee Benjamin C. K.100101ORCID,Thean Aaron Voon-Yew36102,Trung Tran Quang56,Wan Changjin103,Wang Huiliang104ORCID,Wang Joseph105,Wang Ming106107,Wang Sihong108,Wang Ting109,Wang Zhong Lin110111ORCID,Weiss Paul S.112ORCID,Wen Hanqi15113,Xu Sheng114,Xu Tailin115ORCID,Yan Hongping9ORCID,Yan Xuzhou72ORCID,Yang Hui116,Yang Le1117ORCID,Yang Shuaijian118,Yin Lan119ORCID,Yu Cunjiang120,Yu Guihua121ORCID,Yu Jing57ORCID,Yu Shu-Hong122ORCID,Yu Xinge123ORCID,Zamburg Evgeny36102,Zhang Haixia124ORCID,Zhang Xiangyu36102,Zhang Xiaosheng125,Zhang Xueji126ORCID,Zhang Yihui127,Zhang Yu36102,Zhao Siyuan71ORCID,Zhao Xuanhe128ORCID,Zheng Yuanjin129,Zheng Yu-Qing130ORCID,Zheng Zijian131,Zhou Tao132ORCID,Zhu Bowen133ORCID,Zhu Ming134,Zhu Rong135ORCID,Zhu Yangzhi136ORCID,Zhu Yong137,Zou Guijin30ORCID,Chen Xiaodong1138ORCID

Affiliation:

1. Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore

2. Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore

3. Department of Biomedical Engineering, University of Houston, Houston, Texas 77024, United States

4. School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea

5. Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States

6. Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States

7. Department of Chemistry and Biochemistry, California NanoSystems Institute, and Department of Psychiatry and Biobehavioral Sciences, Semel Institute for Neuroscience and Human Behavior, and Hatos Center for Neuropharmacology, University of California, Los Angeles, Los Angeles, California 90095, United States

8. Colloid Chemistry Department, Max Planck Institute of Colloids and Interfaces, 14476 Potsdam, Germany

9. Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States

10. Laboratory of Organic Electronics, Department of Science and Technology, Campus Norrköping, Linköping University, 83 Linköping, Sweden

11. Wallenberg Initiative Materials Science for Sustainability (WISE) and Wallenberg Wood Science Center (WWSC), SE-100 44 Stockholm, Sweden

12. Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States

13. Department of Biomedical Engineering and Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States

14. Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States

15. School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore

16. Nanobionics Group, Department of Chemical and Biological Engineering, Monash University, Clayton, Australia, 3800

17. Monash Institute of Medical Engineering, Monash University, Clayton, Australia3800

18. Applied Mechanics Laboratory, Department of Engineering Mechanics, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China

19. Division of Materials of Science and Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul 04763, Republic of Korea

20. School of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47906, United States

21. Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States

22. Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China

23. Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States

24. Department of Chemistry and Biochemistry, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States

25. Department of Chemistry and the Materials Research Center, Northwestern University, Evanston, Illinois 60208, United States

26. Department of Electronic and Computer Engineering and Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China

27. State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China

28. Laboratory of Flexible Electronics Technology, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China

29. School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore

30. Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore

31. Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, California, 91125, United States

32. Department of Chemical Engineering, Department of Materials Science and Engineering, Department of Electrical Engineering and Computer Science, Applied Physics Program, and Macromolecular Science and Engineering Program, University of Michigan, Ann Arbor, Michigan, 48109 United States

33. Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China

34. National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China

35. Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore

36. Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore

37. The N.1 Institute for Health, National University of Singapore, Singapore 117456, Singapore

38. School of Electronics and Center for Carbon-Based Electronics, Peking University, Beijing 100871, China

39. School of Fashion and Textiles, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China

40. Department of Materials Science and Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States

41. Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, PR China

42. mmh Labs, Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47906, United States

43. Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States

44. Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States

45. Department of Materials Science and Engineering, Pohang University of Science and Engineering (POSTECH), Pohang, Gyeong-buk 37673, Korea

46. Department of Electronic Engineering, Tsinghua University, Beijing 100084, China

47. Department of Biomedical Engineering, Southern University of Science and Technology, No 1088, Xueyuan Road, Xili, Nanshan District, Shenzhen, Guangdong 518055, PR China

48. Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea

49. Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany

50. Terasaki Institute for Biomedical Innovation, Los Angeles, CA, USA

51. Center for Nanoparticle Research, Institute for Basic Science (IBS), School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea

52. Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea

53. Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore

54. National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China

55. NUS Graduate School-Integrative Sciences and Engineering Programme (ISEP), National University of Singapore, Singapore 119077, Singapore

56. School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea

57. School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore

58. Singapore-HUJ Alliance for Research and Enterprise (SHARE), Campus for Research Excellence and Technological Enterprise (CREATE), Singapore 138602, Singapore

59. Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea

60. School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea

61. Institute of Engineering Research, Research Institute of Advanced Materials, Seoul National University, Soft Foundry, Seoul 08826, Republic of Korea

62. Interdisciplinary Program in Bioengineering, Seoul National University, Seoul 08826, Republic of Korea

63. College of Chemistry and Materials Science, Jinan University, Guangzhou, Guangdong 510632, China

64. Department of Biomedical Engineering, Department of Electrical and Computer Engineering, Neuroscience Program, BioMolecular Science Program, and Institute for Quantitative Health Science and Engineering, Michigan State University, East Lansing, Michigan 48823, United States

65. School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China

66. Department of Biomedical Engineering, National University of Singapore, Singapore 117583, Singapore

67. Mechanobiology Institute, National University of Singapore, Singapore 117411, Singapore

68. Institute for Health Innovation and Technology, National University of Singapore, Singapore 119276, Singapore

69. School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China

70. Department of Nano and Chemical Engineering, University of California, San Diego, La Jolla, California 92093-0448, United States

71. John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States

72. School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China

73. Beijing Key Laboratory of Energy Conversion and Storage Materials, College of Chemistry, Beijing Normal University, Beijing 100875, PR China

74. Department of Biomedical Engineering, N.1 Institute for Health, Institute for Health Innovation and Technology (iHealthtech), National University of Singapore, Singapore 119077, Singapore

75. Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States

76. Neural Engineering Centre, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China 518055

77. Department of Aerospace Engineering and Engineering Mechanics, Department of Electrical and Computer Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States

78. Institute of Chemistry and the Center for Nanoscience and Nanotechnology, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel

79. Electrical Engineering Division, Department of Engineering, University of Cambridge CB3 0FA, Cambridge United Kingdom

80. Institute of Industrial Science, The University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan;

81. Darwin College, University of Cambridge, Cambridge CB3 9EU, United Kingdom

82. Department of Biomedical Engineering, Rutgers University, Piscataway, New Jersey 08854, United States

83. School of Chemical Engineering and Samsung Advanced Institute for Health Science and Technology, Sungkyunkwan University, Suwon 16419, Republic of Korea

84. Department of Materials Science and Engineering, Department of Mechanical and Aerospace Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States

85. Department of Chemistry and Biochemistry, University of California, Los Angeles, Los Angeles, California, 90095, United States

86. Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States

87. Department of Materials Science and Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Departments of Electrical and Computer Engineering and Chemistry, and Department of Neurological Surgery, Northwestern University, Evanston, Illinois 60208, United States

88. Becton, Dickinson and Company, 1268 N. Lakeview Avenue, Anaheim, California 92807, United States

89. Ready, Set, Food! 15821 Ventura Blvd #450, Encino, California 91436, United States

90. Material Systems for Nanoelectronics, Chemnitz University of Technology, Chemnitz 09107, Germany

91. Nanophysics, Faculty of Physics, TU Dresden, Dresden 01062, Germany

92. The Institute of Scientific and Industrial Research (SANKEN), Osaka University, Osaka, Japan 5670047

93. School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China

94. Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Institute for Precision Medicine, Center for Flexible Electronics Technology, and IDG/McGovern Institute for Brain Research, Tsinghua University, Beijing, 100084, China

95. Department of Electrical Engineering and Information Systems, Graduate School of Engineering, The University of Tokyo, Tokyo 113-8656, Japan

96. Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China

97. Laboratory of Organic Electronics, Department of Science and Technology, Linköping University, SE-601 74 Norrkoping, Sweden

98. Department of Physics and Electronics, Osaka Metropolitan University, Sakai, Osaka 599-8531, Japan

99. Research Institute for Intelligent Wearable Systems, School of Fashion and Textiles, Hong Kong Polytechnic University, Hong Kong, China

100. Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore

101. iHealthtech, National University of Singapore, Singapore 119276, Singapore

102. Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore

103. School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China

104. Department of Biomedical Engineering, University of Texas at Austin, Austin, Texas 78712, United States

105. Department of Nanoengineering, University of California, San Diego, California 92093, United States

106. Frontier Institute of Chip and System, State Key Laboratory of Integrated Chip and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China

107. the Shanghai Qi Zhi Institute, 41th Floor, AI Tower, No.701 Yunjin Road, Xuhui District, Shanghai 200232, China

108. Pritzker School of Molecular Engineering, The University of Chicago, Chicago, Illinois, 60637, United States

109. State Key Laboratory of Organic Electronics and Information Displays and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing 210023, China

110. Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China

111. Georgia Institute of Technology, Atlanta, Georgia 30332-0245, United States

112. California NanoSystems Institute, Department of Chemistry and Biochemistry, Department of Bioengineering, and Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States

113. Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, China 314000

114. Department of Nanoengineering, Department of Electrical and Computer Engineering, Materials Science and Engineering Program, and Department of Bioengineering, University of California San Diego, La Jolla, California, 92093, United States

115. School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong, 518060, PR China

116. Tianjin Key Laboratory of Molecular Optoelectronic Sciences, Department of Chemistry, School of Science, Tianjin University, Tianjin, China, 300072

117. Department of Materials Science and Engineering, National University of Singapore (NUS), 9 Engineering Drive 1, #03-09 EA, Singapore 117575, Singapore

118. School of Biomedical Sciences, Faculty of Biological Sciences, University of Leeds, Leeds, LS2 9JT, United Kingdom

119. School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, and Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China

120. Department of Engineering Science and Mechanics, Department of Biomedical Engineering, Department of Material Science and Engineering, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania, 16802, United States

121. Materials Science and Engineering Program and Walker Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas, 78712, United States

122. Department of Chemistry, Institute of Biomimetic Materials and Chemistry, Hefei National Research Center for Physical Science at the Microscale, University of Science and Technology of China, Hefei 230026, China

123. Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China

124. National Key Laboratory of Science and Technology on Micro/Nano Fabrication; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China

125. School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China

126. School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong 518060, PR China

127. Applied Mechanics Laboratory, Department of Engineering Mechanics; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China

128. Department of Mechanical Engineering, Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, United States

129. Center for Integrated Circuits and Systems, School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore

130. National Key Laboratory of Science and Technology on Micro/Nano Fabrication; School of Integrated Circuits, Peking University, Beijing 100871, China

131. Department of Applied Biology and Chemical Technology, Faculty of Science, Research Institute for Intelligent Wearable Systems, Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China

132. Center for Neural Engineering, Department of Engineering Science and Mechanics, The Huck Institutes of the Life Sciences, Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, United States

133. Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou 310024, China

134. Institute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, 59 Nanyang Drive, Singapore 636921, Singapore

135. Department of Precision Instrument, Tsinghua University, Beijing 100084, China

136. Terasaki Institute for Biomedical Innovation, Los Angeles, California, 90064, United States

137. Department of Mechanical and Aerospace Engineering, Department of Materials Science and Engineering, and Department of Biomedical Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States

138. Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore

Funder

Ministry of Science and ICT, South Korea

Brain and Behavior Research Foundation

City University of Hong Kong

National Natural Science Foundation of China

Leibniz-Gemeinschaft

Agency for Science, Technology and Research

Ministry of Science and Technology of the People's Republic of China

National Research Foundation of Korea

National Research Foundation Singapore

Adaptable and Seamless Technology Transfer Program through Target-Driven R and D

Air Force Office of Scientific Research

Precursory Research for Embryonic Science and Technology

Division of Engineering Education and Centers

Division of Electrical, Communications and Cyber Systems

Henry Samueli School of Engineering and Applied Science, University of California, Los Angeles

National Institute on Drug Abuse

Division of Civil, Mechanical and Manufacturing Innovation

3M

Division of Chemical, Bioengineering, Environmental, and Transport Systems

Eunice Kennedy Shriver National Institute of Child Health and Human Development

Welch Foundation

Natural Science Foundation of Beijing Municipality

Deutsche Forschungsgemeinschaft

MIT Media Lab

Japan Society for the Promotion of Science

Japan Science and Technology Agency

National University of Singapore

Science and Technology Commission of Shanghai Municipality

Nanyang Technological University

Lingang Laboratory

Institute for Health Innovation and Technology, Department of Biomedical Engineering, National University of Singapore

Institute for Functional Intelligent Materials, National University of Singapore

Publisher

American Chemical Society (ACS)

Subject

General Physics and Astronomy,General Engineering,General Materials Science

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