Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers-Reference-Cited by-同舟云学术

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Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers

Published:2018-01-15 Issue:8 Volume:5 Page:1701285
ISSN:2196-7350
Container-title:Advanced Materials Interfaces
language:en
Short-container-title:Adv. Mater. Interfaces

Author:

Farraj Yousef¹,Layani Michael²,Yaverboim Avi³,Magdassi Shlomo¹^ORCID

Affiliation:

1. Casali Center for Applied Chemistry Institute of Chemistry The Hebrew University of Jerusalem Jerusalem 9190401 Israel

2. School of Materials Science and Engineering Nanyang Technological University Singapore 138602 Singapore

3. Nanoplate Bnei Brak 5126215 Israel

Funder

Ministry of Science, Technology and Space

National Research Foundation Singapore

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admi.201701285

Reference50 articles.

1. Conformal Printing of Electrically Small Antennas on Three-Dimensional Surfaces

2. 3D‐printed spherical dipole antenna integrated on small RF node

3. 3D printing of porous structures by UV-curable O/W emulsion for fabrication of conductive objects

4. 3D Printing: 3D Printing of Shape Memory Polymers for Flexible Electronic Devices (Adv. Mater. 22/2016)

5. Printing a Self-Reducing Copper Precursor on 2D and 3D Objects to Yield Copper Patterns with 50% Copper's Bulk Conductivity

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Decomposition mechanism and morphological evolution of in situ realized Cu nanoparticles in Cu complex inks;New Journal of Chemistry;2024

2. Self-reducing molecular ink for printed electronics and lithium-ion battery cathodes as conductive binder;Journal of Materials Chemistry C;2024

3. Advanced Applications of Metal–Organic Decomposition Inks in Printed Electronics;ACS Applied Electronic Materials;2023-12-22

4. Laser‐Activated Selective Electroless Plating on 3D Structures via Additive Manufacturing for Customized Electronics;Advanced Materials Technologies;2023-08-02

5. Recent progress in functionalized plastic 3D printing in creation of metallized architectures;Materials & Design;2023-08

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