Printing a Self-Reducing Copper Precursor on 2D and 3D Objects to Yield Copper Patterns with 50% Copper's Bulk Conductivity-Reference-Cited by-同舟云学术

Printing a Self-Reducing Copper Precursor on 2D and 3D Objects to Yield Copper Patterns with 50% Copper's Bulk Conductivity

Published:2014-12-22 Issue:3 Volume:2 Page:1400448
ISSN:2196-7350
Container-title:Advanced Materials Interfaces
language:en
Short-container-title:Adv. Mater. Interfaces

Author:

Rosen Yitzchak¹,Grouchko Michael¹,Magdassi Shlomo¹

Affiliation:

1. Casali Center for Applied Chemistry; Institute of Chemistry; The Center for Nanoscience and Nanotechnology; The Hebrew University of Jerusalem; Jerusalem 91904 Israel

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/admi.201400448/fullpdf

Reference26 articles.

1. Plasma and Microwave Flash Sintering of a Tailored Silver Nanoparticle Ink, Yielding 60% Bulk Conductivity on Cost-Effective Polymer Foils

2. Nanoinks in inkjet metallization — Evolution of simple additive-type metal patterning

3. Honey, I shrunk the mask

4. Nanoscale Electronics: Digital Fabrication by Direct Femtosecond Laser Processing of Metal Nanoparticles

5. Conductive Nanomaterials for Printed Electronics

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