Decomposition mechanism and morphological evolution of <i>in situ</i> realized Cu nanoparticles in Cu complex inks-Reference-Cited by-同舟云学术

Decomposition mechanism and morphological evolution of in situ realized Cu nanoparticles in Cu complex inks

Published:2024 Issue:15 Volume:48 Page:6796-6808
ISSN:1144-0546
Container-title:New Journal of Chemistry
language:en
Short-container-title:New J. Chem.

Author:

Mohan Nihesh¹^ORCID,Ahuir-Torres Juan Ignacio²^ORCID,Bhogaraju Sri Krishna¹^ORCID,Webler Ralf³,Kotadia Hiren R.²^ORCID,Erdogan Huseyin⁴,Elger Gordon¹^ORCID

Affiliation:

1. Institute of Innovative Mobility, Technische Hochschule Ingolstadt, Esplanade 10, 85049, Ingolstadt, Germany

2. School of Engineering, Liverpool John Moores University, Liverpool, L3 3AF, UK

3. Schlenk SE, Barnsdorfer Hauptstrasse 5, 91154 Roth-Barnsdorf, Germany

4. Conti Temic Microelectronic GmbH, Ringlerstrasse 17, 85057 Ingolstadt, Germany

Abstract

Controlling in situ nanoparticle formation and growth in Cu complex inks during decomposition and sintering process by modifying ink chemistry (complexing molar ratio, organic solvent) and influencing sintering parameters (temperature, ramp rate).

Funder

Bayerische Forschungsverbünde

Publisher

Royal Society of Chemistry (RSC)

Link

http://pubs.rsc.org/en/content/articlepdf/2024/NJ/D3NJ05185D

Reference59 articles.

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