Characteristic analysis of electroless Ni plating layer for electronic packaging-Reference-Cited by-同舟云学术

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Characteristic analysis of electroless Ni plating layer for electronic packaging

Published:2006 Issue:4 Volume:38 Page:440-443
ISSN:0142-2421
Container-title:Surface and Interface Analysis
language:en
Short-container-title:Surf. Interface Anal.

Author:

Kim Dae-Gon,Kim Jong-Woong,Yoon Jeong-Won,Lee Won-Bae,Jung Seung-Boo

Publisher

Wiley

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference8 articles.

1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology

2. Solid state interfacial reaction and joint strength of Sn–37Pb solder with Ni–P under bump metallization in flip chip application

3. Studies of the mechanical and electrical properties of lead-free solder joints

4. Studies on crystallization of electroless NiP deposits

5. Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Preparation and characterization of bimetallic Pt^Ni-P/CNT catalysts via galvanic displacement reaction on electrolessly-plated Ni-P/CNT;Green Energy & Environment;2018-10

2. Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental Conditions;Journal of Nanoscience and Nanotechnology;2018-09-01

3. Magnetic properties of electrodeposited Ni‒P alloys with varying phosphorus content;Russian Journal of Physical Chemistry A;2017-02

4. Metallization of Kevlar Fibers with Gold;ACS Applied Materials & Interfaces;2011-05-16

5. Polyallylammonium Ferrocyanide Films for Trace Water Detection in Halogenated Solvents;Electroanalysis;2009-12

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