Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental Conditions-Reference-Cited by-同舟云学术

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Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental Conditions

Published:2018-09-01 Issue:9 Volume:18 Page:6162-6166
ISSN:1533-4880
Container-title:Journal of Nanoscience and Nanotechnology
language:en
Short-container-title:j nanosci nanotechnol

Author:

Kim Kyung-Yeol¹,Myung Woo-Ram²,Jeong Haksan¹,Sung Yong-Gue¹,Jung Seung-Boo¹

Affiliation:

1. School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon-Si, 440-746, Korea

2. SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon-Si, 440-746, Korea

Publisher

American Scientific Publishers

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructures and Mechanical Properties of Sn-58 wt.% Bi Solder with Ag-Decorated Multiwalled Carbon Nanotubes Under 85°C/85% Relative Humidity Environmental Conditions;Journal of Electronic Materials;2019-12-02

2. A Capacitive Type Humidity Sensor with Potassium Ion Doped TiO2 Thin Film as Humidity Sensing Material;Journal of Nanoelectronics and Optoelectronics;2018-11-01

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