Solid state interfacial reaction and joint strength of Sn–37Pb solder with Ni–P under bump metallization in flip chip application-Reference-Cited by-同舟云学术

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Solid state interfacial reaction and joint strength of Sn–37Pb solder with Ni–P under bump metallization in flip chip application

Published:2005-05 Issue:1-2 Volume:395 Page:80-87
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Kim Dae-Gon,Kim Jong-Woong,Lee Jung-Goo,Mori Hirotaro,Quesnel David J.,Jung Seung-Boo

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference23 articles.

1. Long time reliability study of soldered flip chips on flexible substrates

2. Electromigration in flip chip solder bump of 97Pb–3Sn/37Pb–63Sn combination structure

3. Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

4. Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization

5. The influence of Sn–Cu–Ni(Au) and Sn–Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates

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1. Effect of introducing high temperature gradients on IMC growth and shear properties in hourglass-shaped microbump joints during thermocompression bonding;Journal of Materials Science: Materials in Electronics;2023-03

2. Size effects on IMC growth of Cu/Ni/Sn-3.5Ag microbump joints during isothermal aging and prediction of shear strength using ANN;Journal of Materials Research and Technology;2022-05

3. Competitive failure mechanism and load tolerance of solder joint under thermo-mechano-electrical coupling;Mechanics of Materials;2021-12

4. Effect of extreme thermal shocking on the reliability of Sn50Pb49Sb1/Cu solder joint;Journal of Materials Science: Materials in Electronics;2019-12-04

5. Nanomechanical properties of Ag solder bumps doped with Pd and Au;Microelectronics Reliability;2017-12

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