Novel flexible electrically conductive adhesives from functional epoxy, flexibilizers, micro-silver flakes and nano-silver spheres for electronic packaging-Reference-Cited by-同舟云学术

Novel flexible electrically conductive adhesives from functional epoxy, flexibilizers, micro-silver flakes and nano-silver spheres for electronic packaging

Published:2013-01 Issue: Volume: Page:n/a-n/a
ISSN:0959-8103
Container-title:Polymer International
language:en
Short-container-title:Polym. Int

Author:

Cui Hui-wang,Fan Qiong¹,Li Dong-sheng¹

Affiliation:

1. Key State Laboratory for New Displays and System Applications and SMIT Center, College of Automation and Mechanical Engineering; Shanghai University; Shanghai; 200072; China

Publisher

Wiley

Subject

Polymers and Plastics,Materials Chemistry,Organic Chemistry

Reference35 articles.

1. High performance conductive adhesives

2. Reliability evaluation of adhesive bonded SMT components in industrial applications

3. Effects of the treatment of attapulgite and filler contents on tensile properties of PTFE and attapulgite reinforced fabric composites

4. Synergistic Effect of Epoxy/Organophilic Montorillonite Nanocomposites and Triphenyl Phosphate on Flame Retardance Enhancement of Polypropylene

5. Studies on the thermal stabilization enhancement of ABS; synergistic effect by triphenyl phosphate and epoxy resin mixtures

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