High performance conductive adhesives
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Link
http://xplorestaging.ieee.org/ielx5/6104/17699/00816103.pdf?arnumber=816103
Cited by 26 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Novel lead-connection technology for thin-film temperature sensors with arbitrary electrode lengths;Measurement Science and Technology;2023-03-16
2. The synergistic effect of micron spherical and flaky silver-coated copper for conductive adhesives to achieve high electrical conductivity with low percolation threshold;International Journal of Adhesion and Adhesives;2021-09
3. A Ka-Band Wideband Matched Load Based on Lossy Waveguide Structures;IEEE Microwave and Wireless Components Letters;2020-11
4. Cu-Cu Bonding with Cu Nanowire Arrays for Electronics Integration;2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC);2020-09-15
5. Impact Tests;Handbook of Adhesion Technology;2018
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