1. Liu J. Polymeric electronic packaging-worldwide achievements and future challenges. First International Conference on Adhesive Joining Technology in Electronics, Berlin, 1994
2. Gilleo K. Assembly with conductive adhesives. Soldering and surface mount technology. No. 19, 1995
3. Warren R, Derfelt D, Hoge CE. Test methodologies for characterization of die bond adhesives for non-hermetic packaging. IEPS Conference, 1995
4. Perichaud MG, Deletage JY, Carboni D, Fremont H, Danto Y, Faure C. Thermomechanical behavior of adhesive jointed SMT components. Third International Conference on adhesive joining and coating technology in electronics manufacturing, Binghamton, NY, 28–30 September 1998. p. 55–61
5. Liu J, Gustafsson K, Lai Z, Li C. Surface characteristics, reliability and failure mechanisms of tin, copper and gold metallisations. Adhesives in Electronics ’96. Stockholm, 1996. p. 141–53