Development of Thermal Conductive tpPI /Oriented h‐BN Insulating Composite Material Using the Electrostatic Adsorption Method
Author:
Affiliation:
1. Toyohashi University of Technology Higarigaoka 1‐1, Tempaku‐cho Toyohashi 441‐8580 Japan
Publisher
Wiley
Subject
Electrical and Electronic Engineering
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/tee.23228
Reference12 articles.
1. Development of epoxy/BN composites with high thermal conductivity and sufficient dielectric breakdown strength;Wang Z;IEEE Trans. on DEI,2011
2. Boron nitride based poly(phenylene sulfide) composites with enhanced thermal conductivity and breakdown strength;Huang X;IEEJ Trans. Fundamental. Mater.,2013
3. Symposia on Low‐Dimensional Nanoscale Elect and Photonic Devices 5 and State‐of‐the‐Art Program on Cpd Semicond 54 (SOTAPOCS 54);Muto H,2012
4. S.Use T.Kawashima M.NagaoandY.Murakami: " Development of thermal conductive PMMA/BN electric insulating composite material produced by electrostatic adsorption method" 2016 Annual Report. Conference on Electrical Insulation and Dielectric Phenomena USB‐Memory No.4B‐11 pp.380–383(2016)
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