Filler Particle Size Effect on Electrically and Thermally Properties of Thermal Conductive Thermoplastic Polyimide/Hexagonal Boron Nitride Composite Materials Fabricated by the Electrostatic Adsorption Method

Author:

Murakami Yoshinobu1,Ichiba Yujin1,Kawashima Tomohiro1,Hozumi Naohiro1

Affiliation:

1. Department of Electrical and Electronic Information Engineering Toyohashi University of Technology, Hibarigaoka 1‐1, Tempaku‐cho Toyohashi 441‐8580 Japan

Abstract

Composite materials with high heat dissipation and acceptable insulating properties are being developed. Minimizing filler contacts in the composite and is crucial for composite insulating materials. Here, an electrostatic adsorption method was used to prepare thermoplastic polyimide (tpPI) / orientation micro‐sized hexagonal boron nitride (h‐BN) composite insulating materials. Then the effects of h‐BN particle size on the thermal conductivity and DC breakdown strength were investigated. Additionally, the finite element method was used for heat conduction analysis and the results were compared to the measurements. The particle size of the h‐BN significantly influences the dc breakdown strength and the thermal conductivity. © 2024 Institute of Electrical Engineers of Japan and Wiley Periodicals LLC.

Funder

Japan Society for the Promotion of Science

Publisher

Wiley

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