Electrical Treeing Breakdown Characteristics of Epoxy/Spherical Boron Nitride with Card‐House Structure Composites
Author:
Affiliation:
1. Department of Electrical and Electronic Imformation Engineering, Toyohashi University of Technology Higarigaoka 1‐1, Tempaku‐cho, Toyohashi 441‐8580 Japan
Publisher
Wiley
Subject
Electrical and Electronic Engineering
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/tee.23508
Reference12 articles.
1. Comparison of Trench Gate IGBT and CIGBT Devices for Increasing the Power Density From High Power Modules
2. Power Density Optimization of 700 kHz GaN-Based Auxiliary Power Module for Electric Vehicles
3. Development of epoxy/BN composites with high thermal conductivity and sufficient dielectric breakdown strength partI - sample preparations and thermal conductivity
4. Boron Nitride Based Poly(phenylene sulfide) Composites with Enhanced Thermal Conductivity and Breakdown Strength
5. Development of Thermal Conductive tpPI /Oriented h‐BN Insulating Composite Material Using the Electrostatic Adsorption Method
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Enhanced Anticarbonization and Electrical Performance of Epoxy Resin via Densified Spherical Boron Nitride Networks;ACS Applied Electronic Materials;2023-07-17
2. Modelling the Electric Field Distribution in Polyethylene Nano-Composite to Investigate Electrical Treeing Initiation Using Finite Element Method;IEEC 2022;2022-08-03
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