Microstructural Evolution and Mechanical Properties of Intermetallics at the CuW/Al Interface with a Ni Interlayer-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Microstructural Evolution and Mechanical Properties of Intermetallics at the CuW/Al Interface with a Ni Interlayer

Published:2019-03-22 Issue:7 Volume:21 Page:1801273
ISSN:1438-1656
Container-title:Advanced Engineering Materials
language:en
Short-container-title:Adv. Eng. Mater.

Author:

Wang Chan¹²,Liang Shuhua¹²^ORCID,Cao Fei¹²

Affiliation:

1. School of Materials Science and EngineeringXi'an University of TechnologyNo. 5 Jinhua South RoadXi'an 710048P. R. China

2. Shaanxi Province Key Laboratory of Electrical Materials and Infiltration TechnologyXi'an University of TechnologyXi'an 710048P. R. China

Funder

National Natural Science Foundation of China

Education Department of Shaanxi Province

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adem.201801273

Reference49 articles.

1. Effect of Cr alloying interlayer on the interfacial bond strength of CuW/CuCr integral materials

2. Microstructural evolution and mechanical properties of CuW/CuCr interface with mixed powder interlayers by liquid diffusion bonding technique

3. Effect of Alloying Interlayer on Interfacial Bond Strength of CuW/CuCr Integral Materials

4. Effect of Sc and Zr on Microstructure and Mechanical Properties of As-Cast Al-Li-Cu Alloys

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Improvement on interfacial properties of CuW and CuCr bimetallic materials with high-entropy alloy interlayers via infiltration method;Science and Engineering of Composite Materials;2024-01-01

2. Microstructural Evolution and Properties of Cuw/Cucr Interface Bonded with Cucrnixtizr High Entropy Alloy Interlayers;2024

3. Study on the arc erosion resistance and mechanism of Cr- doped W Cu composites;Materials Characterization;2023-11

4. Investigation on Interface of CuW/Al Composite Using Ni Interlayer by Vacuum Hot-Pressing Diffusion Bonding;Metals;2023-05-27

5. Microstructure evolution and mechanical properties of CuW/Al interface fabricated by infiltration and vacuum hot-pressing diffusion bonding;Vacuum;2023-04

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3