Investigation on Interface of CuW/Al Composite Using Ni Interlayer by Vacuum Hot-Pressing Diffusion Bonding
Author:
Affiliation:
1. School of Materials Science and Chemical Engineering, Xi’an Technological University, Xi’an 710021, China
2. School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China
Abstract
Funder
National Natural Science Foundation of China
Shaanxi Outstanding Youth Fund
Shaanxi Provincial Education Department
Publisher
MDPI AG
Subject
General Materials Science,Metals and Alloys
Link
https://www.mdpi.com/2075-4701/13/6/1029/pdf
Reference61 articles.
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3. Improved microstructure and shear strength of the Al/steel bimetal prepared by compound casting under magnetic field;Yu;J. Alloys Compd.,2023
4. The effect of microstructural aspects of W-Cu composites on electrical conductivity and thermal erosion;Hamidi;Int. J. Refract. Met. Hard Mater.,2021
5. Improving the mechanical performance of Cu-Cr alloy by dissolving Cu in the Cr second phase;Shan;Mater. Charact.,2021
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