Microstructural Evolution and Properties of Cuw/Cucr Interface Bonded with Cucrnixtizr High Entropy Alloy Interlayers

Author:

Yang Xiaohong,Liu Jiahui,Zhang Baocha,Sun Xiaoyong,Xiao Peng,Liang shuhua

Publisher

Elsevier BV

Reference34 articles.

1. Interface microstructure evolution of a novel CuW/Al composite fabricated by an infiltration method[J];Chan Wang;Journal of Alloys and Compounds,2020

2. Effects of grading tungsten powders on properties of CuW alloy;Juntao Zou;Materials Research Express,2020

3. Effect of sintering temperature on fine-grained Cu W composites with high copper[J];Xiran Wang;Materials Characterization,2019

4. Microstructural Evolution and Mechanical Properties of Intermetallics at the CuW/Al Interface with a Ni Interlayer[J];Chan Wang;Advanced Engineering Materials,2019

5. Aging behavior and precipitates analysis of the Cu-Cr-Zr-Ce alloy;Yi Zhang;Materials Science and Engineering: A,2016

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