Microstructure evolution and mechanical properties of CuW/Al interface fabricated by infiltration and vacuum hot-pressing diffusion bonding
Author:
Funder
National Natural Science Foundation of China
China Postdoctoral Science Foundation
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference46 articles.
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3. Microstructure and properties of W-25wt% Cu composites reinforced with tungsten carbide produced by an in situ reaction;Zhang;Vacuum,2020
4. Fabrication of functionally graded W-Cu composite via variable speed induction sintering and subsequent infiltration;Mahmoudi;Int. J. Refract. Met. Hard Mater.,2022
5. Nanocompound-induced anti-softening mechanisms: application to CuCr alloys;Yang;Mater. Sci. Eng., A,2022
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