The influence of Ti interlayer on the microstructure evolution and mechanical properties of CuW/Al composite
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference64 articles.
1. Low-temperature densification and microstructure of W-Cu composites with Sn additives;Li;J. Mater. Res. Technol.,2021
2. Microstructure and mechanical properties of amorphous strip/aluminum laminated composites fabricated by ultrasonic additive consolidation;Wang;Mater. Sci. Eng., A,2019
3. Microstructure and age hardening behavior of Al/Fe bimetal prepared by one-step compound casing;Wang;J. Alloys Compd.,2022
4. Improved microstructure and shear strength of the Al/steel bimetal prepared by compound casting under magnetic field;Yu;J. Alloys Compd.,2023
5. Nanocompound-induced anti-softening mechanisms: application to CuCr alloys;Yang;Mater. Sci. Eng., A,2022
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1. Thermal fatigue failure mechanism in the joint of nano Cu/Ti–Si3N4 ceramic substrates after thermal fatigue test;Ceramics International;2024-04
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