Thermal fatigue failure mechanism in the joint of nano Cu/Ti–Si3N4 ceramic substrates after thermal fatigue test
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
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1. Thermal cycling simulation and fatigue lifetime estimation of Si3N4-AMB substrates;Materials Science in Semiconductor Processing;2024-11
2. Joint Microstructure and Performance of Brazing Si3N4‐MoSi2 Composites to Nb with AgCuTi and AgCuTi+MoSi2p Active Fillers;Advanced Engineering Materials;2024-08-28
3. Enhanced properties in Si3N4/Cu AMB joints through regulating interfacial reaction modes induced by Mo-particle additives;Ceramics International;2024-08
4. Thermal Cycling Simulation and Fatigue Lifetime Estimation of Si3n4-Amb Substrates;2024
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