Intermetallic Layer Growth Kinetics in Sn-Ag-Cu System using Diffusion Multiple and Reflow Techniques-Reference-Cited by-同舟云学术

Intermetallic Layer Growth Kinetics in Sn-Ag-Cu System using Diffusion Multiple and Reflow Techniques

Published:2014-07-22 Issue:4 Volume:17 Page:512-522
ISSN:1438-1656
Container-title:Advanced Engineering Materials
language:en
Short-container-title:Adv. Eng. Mater.

Author:

Pawełkiewicz Magdalena¹,Danielewski Marek²,Janczak-Rusch Jolanta¹

Affiliation:

1. Laboratory for Joining Technologies and Corrosion, Empa; Swiss Federal Laboratories for Materials Science and Technology; Überlandstrasse 129 8600 Dübendorf Switzerland

2. AGH University of Science and Technology; Al. Mickiewicza 30 30-059 Kraków Poland

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

Reference64 articles.

1. Lead-free Solders in Microelectronics

2. Tin–lead (SnPb) solder reaction in flip chip technology

3. Interfacial reactions between lead-free solders and common base materials

4. EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing

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