A Model for Intermetallic Growth in Thin Sn Joints Between Cu Substrates: Application to Solder Microjoints-Reference-Cited by-同舟云学术

A Model for Intermetallic Growth in Thin Sn Joints Between Cu Substrates: Application to Solder Microjoints

Published:2020-02-27 Issue:5 Volume:49 Page:3367-3382
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Arafat Y.,Yang H.,Dutta I.,Kumar P. A.,Datta B.

Funder

Missile Defense Agency

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-020-08019-8.pdf

Reference40 articles.

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3. Z. Chen, B. Talebanpour, Z. Huang, P. Kumar, and I. Dutta, in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC), pp. 534–537 (2013).

4. B. Talebanpour, Z. Huang, Z. Chen, and I. Dutta, J. Electron. Mater. 45, 57–68 (2016). https://doi.org/10.1007/s11664-015-4066-0.

5. P. Ajay Kumar and I. Dutta, J. Electron. Mater. 47, 5488–5497 (2018). https://doi.org/10.1007/s11664-018-6434-z.

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