EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing-Reference-Cited by-同舟云学术

EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing

Published:2013-09-18 Issue:1 Volume:43 Page:219-228
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Wang S. J.,Hsu L. H.,Wang N. K.,Ho C. E.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-013-2675-z.pdf

Reference18 articles.

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3. B. Lin, and T. Gregorich, Proceedings of the 6th Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011, p. 218.

4. H.Y. Chuang, T.L. Yang, M.S. Kuo, Y.J. Chen, J.J. Yu, C.C. Li, and C.R. Kao, IEEE Trans. Device Mater. Reliab. 12, 233 (2012).

5. H.W. Lin, J.L. Lu, C.M. Liu, C. Chen, K.N. Tu, D. Chen, and J.C. Kuo, Proceedings of the 7th Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012, p. 90.

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