Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging
Author:
Publisher
Informa UK Limited
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1179/1743284711Y.0000000131
Reference17 articles.
1. Effects of multiple reflows on interfacial reaction and shear strength of SnAgCu and SnPb solder joints with different PCB surface finishes
2. Experiments and simulations of uniaxial ratchetting deformation of Sn–3Ag–0.5Cu and Sn–37Pb solder alloys
3. Comparison of drop performance between the Sn37Pb and the Sn3.8Ag0.7Cu solder joints subjected to drop test
4. Spalling behavior of interfacial intermetallic compounds in Pb-free solder joints subjected to temperature cycling loading
5. Research on Creep Properties of Sn2.5Ag0.7CuXRE Lead-Free Soldered Joints for Surface Mount Technology
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of Al Addition on Electrochemical Behavior of Sn-0.7Cu-xAl Lead-Free Solders Alloys in 3.5 wt.% NaCl Solution;Journal of Materials Engineering and Performance;2022-03-18
2. The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading;Metals;2019-05-05
3. Microstructural evolution and IMCs growth behavior of Sn-58Bi-0.25Mo solder joint during aging treatment;Materials Research Express;2018-02-21
4. Effect of Ni addition on the wettability and microstructure of Sn2.5Ag0.7Cu0.1RE solder alloy;Materials & Design;2017-04
5. Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy;Materials & Design;2015-02
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