Effect of Al Addition on Electrochemical Behavior of Sn-0.7Cu-xAl Lead-Free Solders Alloys in 3.5 wt.% NaCl Solution
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
https://link.springer.com/content/pdf/10.1007/s11665-022-06771-y.pdf
Reference37 articles.
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3. Q.K. Zhang, W.M. Long, X.Q. Yu, Y.Y. Pei and P.X. Qiao, Effects of Ga Addition on Microstructure and Properties of Sn-Ag-Cu/Cu Solder Joints, J. Alloys Compd., 2015, 622, p 973–978. https://doi.org/10.1016/j.jallcom.2014.11.030
4. M. Lachab, A. Attia and C. Llinares, Study on the Properties of CuInSe, J. Cryst. Growth, 2005, 280(07), p 474–482.
5. A.E. Hammad, Enhancement of Creep Resistance and Thermal Behavior of Eutectic Sn-Cu Lead-Free Solder Alloy by Ag and In-Additions, Mater. Des., 2012, 40, p 292–298. https://doi.org/10.1016/j.matdes.2012.04.007
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