Microstructure and mechanical properties of Sn-In and Sn-Bi solders-Reference-Cited by-同舟云学术

Microstructure and mechanical properties of Sn-In and Sn-Bi solders

Published:1993-07 Issue:7 Volume:45 Page:25-27
ISSN:1047-4838
Container-title:JOM
language:en
Short-container-title:JOM

Author:

Morris J. W.,Goldstein J. L. Freer,Mei Z.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF03222376.pdf

Reference6 articles.

1. R.J.K. Wassink, Soldering in Electronics, 2nd ed. (Ayr, Scotland: Electrochemical Publications Limited, 1989), p. 196.

2. C. Lea, A Scientific Guide to Surface Mount Technology (Ayr, Scotland: Electrochemical Publications Limited, 1988), p. 171.

3. R. Kubiak, M. Wolcyrz, and W. Zacharko, J. Less-Common Met., 65 (1979), p. 263.

4. J.L. Freer and J.W. Morris, jr., Electronic Mater., 21 (1992), p. 647.

5. A.D. Romig, Jr., F.G. Yost, and P.F. Hlava, Microbeam Analysis—1984, ed. A.D. Romig and J.I. Goldstein (San Francisco, CA: San Francisco Press, 1984), p. 87.

Cited by 107 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Strength-enhanced Sn–In low-temperature alloy with surface-modified ZrO2 nanoparticle addition;Journal of Materials Science: Materials in Electronics;2023-11

2. Thermodynamic Assessment of Tin Based Molten Binary Indium-Tin Solder Alloys;Proceedings of the International Conference on Metallurgical Engineering and Centenary Celebration;2023-10-15

3. Effect of electric pulse incubation melt on solidified microstructures and mechanical properties of Sn58Bi alloy;Journal of Materials Science: Materials in Electronics;2023-10

4. Void-free interface between In and high-impurity Cu joint;Science and Technology of Welding and Joining;2023-09-20

5. Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology;Journal of Materials Research and Technology;2023-05