Microstructure and mechanical properties of Sn-In and Sn-Bi solders-Reference-Cited by-同舟云学术

Microstructure and mechanical properties of Sn-In and Sn-Bi solders

Published:1993-07 Issue:7 Volume:45 Page:25-27
ISSN:1047-4838
Container-title:JOM
language:en
Short-container-title:JOM

Author:

Morris J. W.,Goldstein J. L. Freer,Mei Z.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF03222376.pdf

Reference6 articles.

1. R.J.K. Wassink, Soldering in Electronics, 2nd ed. (Ayr, Scotland: Electrochemical Publications Limited, 1989), p. 196.

2. C. Lea, A Scientific Guide to Surface Mount Technology (Ayr, Scotland: Electrochemical Publications Limited, 1988), p. 171.

3. R. Kubiak, M. Wolcyrz, and W. Zacharko, J. Less-Common Met., 65 (1979), p. 263.

4. J.L. Freer and J.W. Morris, jr., Electronic Mater., 21 (1992), p. 647.

5. A.D. Romig, Jr., F.G. Yost, and P.F. Hlava, Microbeam Analysis—1984, ed. A.D. Romig and J.I. Goldstein (San Francisco, CA: San Francisco Press, 1984), p. 87.

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