Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference17 articles.
1. The effect of downscaling the dimensions of solder interconnects on their creep properties;Wiese;Microelectron Reliab,2008
2. Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder;Tsao;Mater Des,2010
3. Reliability studies of Sn–9Zn/Cu and Sn–9Zn–0. 06Nd/Cu joints with aging treatment;Hu;Mater Des,2012
4. Effect of phosphorus element on the comprehensive properties of Sn–Cu lead-free solder;Li;J Alloy Compd,2010
5. Effects of nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder;Tsao;Mater Des,2010
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