Experiments and simulations of uniaxial ratchetting deformation of Sn–3Ag–0.5Cu and Sn–37Pb solder alloys-Reference-Cited by-同舟云学术

Experiments and simulations of uniaxial ratchetting deformation of Sn–3Ag–0.5Cu and Sn–37Pb solder alloys

Published:2008-05-02 Issue:4 Volume:20 Page:343-353
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Kobayashi Takuji,Sasaki Katsuhiko

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-008-9732-z.pdf

Reference36 articles.

1. Official Journal of the European Union L37 (Office for Official Publications of the European Communities, Luxembourg, 2003), p. 19

2. X.Q. Shi, W. Zhou, H.L.J. Pang, Z.P. Wang, J. Electron. Packag. 121, 179 (1999). doi: 10.1115/1.2792681

3. X. Chen, D.H. Yu, K.S. Kim, Mater. Sci. Eng. A 406, 86 (2005). doi: 10.1016/j.msea.2005.06.013

4. S. Vaynman, E.F. Morris, D.A. Jeannotte, in Solder mechanics—a state of the art assessment, ed. by D.R. Frear, W.B. Jones, K.R. Kinsman (The Minerals, Metals and Materials Society, Pennsylvania, 1991), p. 155

5. K. Ohguchi, K. Sasaki, M. Ishibashi, T. Hoshino, JSME Int. J. Ser. A47, 371 (2004). doi: 10.1299/jsmea.47.371

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