Plasticity-Creep Separation Method for Viscoplastic Deformation of Lead-Free Solders
Author:
Affiliation:
1. Department of Material Science and Engineering, Akita University
2. Division of Mechanical Science, Hokkaido University
3. Environment and Material Research Laboratories, NEC Corporation
4. NEC Information Systems, Ltd.
Publisher
Japan Society of Mechanical Engineers
Subject
Mechanical Engineering,General Materials Science
Link
http://www.jstage.jst.go.jp/article/jsmea/47/3/47_3_371/_pdf
Reference14 articles.
1. Effect of Ag Content on Properties of Sn-Ag Binary Alloy Solder
2. Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints
3. Microstructure changes in Sn-3.5Ag solder alloy during creep
4. Modelling the creep rates of eutectic Bi–Sn solder using the data from its constitutive phases
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