Characterisation of insulated Cu wire ball bonding-Reference-Cited by-同舟云学术

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Characterisation of insulated Cu wire ball bonding

Published:2014-12-05 Issue:sup6 Volume:18 Page:S6-269-S6-273
ISSN:1432-8917
Container-title:Materials Research Innovations
language:en
Short-container-title:Materials Research Innovations

Author:

Leong H. Y.¹,Yap B. K.¹,Khan N.²,Ibrahim M. R.²,Tan L. C.²,Faiz M.³

Affiliation:

1. Centre for Microelectronic and Nano EngineeringCOE, Universiti Tenaga Nasional, KM7 Jalan Ikram-Uniten, 43009 Kajang, Selangor, Malaysia

2. Fresscale Semiconductor Malaysia SDN BHD, Free Industrial Zone Sungai Way, 47300 Petaling Jaya, Selangor, Malaysia

3. Department of Mechanical EngineeringFaculty of Engineering Building, University of Malaya, 50603 Kuala Lumpur, Malaysia

Publisher

Informa UK Limited

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.tandfonline.com/doi/pdf/10.1179/1432891714Z.0000000001019

Reference9 articles.

1. Overview of wire bonding using copper wire or insulated wire

2. Challenges and developments of copper wire bonding technology

3. Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding

4. Optimizing the fine-pitch copper wire bonding process with multiple quality characteristics using a grey-fuzzy Taguchi method

5. Enhancing bondability with coated copper bonding wire

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Copper Wire Bonding: A Review;Micromachines;2023-08-16

2. Analysis of Transmission Performance for Fine Pitch Interconnect;Solid State Phenomena;2023-05-30

3. Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging;Micromachines;2023-04-12

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