Author:
Liu Peisheng,Tong Liangyu,Wang Jinlan,Shi Lei,Tang Hao
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference63 articles.
1. Appelt BK, Tseng A, Lai YS, Chen CH. Copper wire bonding-a maturing technology. In: Proceedings of 12th electronics packaging technology conference; 2010. p. 479–83.
2. A new approach in free air ball formation process parameters analysis;Chen;IEEE Trans Electron Packaging Manuf,2000
3. Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding;Pequegnat;Microelectron Reliab,2011
4. Ho HM, Tan J, Chen CT, Boon HT, Xavier P. Modeling energy transfer to copper wire for bonding in an inert environment. In: Proceedings of 7th electronic packaging technology conference; 2005. p. 292–97.
5. Overview of wire bonding using copper wire or insulated wire;Zhong;Microelectronics Reliability,2011
Cited by
57 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献