Research on Alloying Elements’ Influence on CuETP-Grade Copper’s Mechanical and Electrical Properties

Author:

Franczak Krystian1ORCID,Sadzikowski Michał1ORCID,Kwaśniewski Paweł1ORCID,Kiesiewicz Grzegorz1ORCID,Ściężor Wojciech1,Kordaszewski Szymon1

Affiliation:

1. Faculty of Non-Ferrous Metals, AGH University of Krakow, 30-059 Krakow, Poland

Abstract

The continuous industrial development that occurs worldwide generates the need to develop new materials with increasingly higher functional properties. This need also applies to the basic material for electricity purposes, which is copper. In this article, we carry out studies on the influence of various alloying elements such as Mg, In, Si, Nb, Hf, Sb, Ni, Al, Fe, Zr, Cr, Zn, P, Ag, Sc, Pb, Sn, Co, Ti, Mn, Te and Bi on the electrical and mechanical properties of ETP-grade copper. The research involves producing copper alloys using the gravity die casting method with alloy additions of 0.1 wt.%, 0.3 wt.% and 0.5 wt.%. All resulting materials are cold-worked to produce wires, which are subsequently homogenized and annealed. The materials produced in this manner undergo testing to determine their specific electrical conductivity, tensile strength, yield strength, elongation and Vickers hardness (HV10 scale).

Funder

The National Centre for Research and Development–Research Project

Publisher

MDPI AG

Reference37 articles.

1. Davis, J.R. (2001). ASM Specialty Handbook: Copper and Copper Alloys, ASM International.

2. Warlimont, H., and Martienssen, W. (2018). Springer Handbook of Materials Data, Springer Nature Switzerland AG.

3. Challenges and developments of copper wire bonding technology;Liu;Microelectron. Reliab.,2012

4. Annealing behavior of gradient structured copper and its effect on mechanical properties;Guo;Mater. Sci. Eng. A,2017

5. Gale, W.G., and Totemeier, T.C. (2003). Smithells Metals Reference Book, Elsevier Butterworth-Heinemann. [8th ed.].

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3